Signal Integrity Engineer
Overview
Join a growing hardware engineering team focused on advancing high-speed electronic systems. As a Signal Integrity Engineer, you will lead end-to-end signal integrity analysis across PCBs, chip packages, substrates, components, and interconnects. Your work will help optimize channel performance from early pre-silicon modeling through design iteration and, when needed, post-silicon validation.
You’ll collaborate with a multidisciplinary team to build 3D electromagnetic models, evaluate complex high-speed interfaces, identify signal performance bottlenecks, and guide design decisions that support reliable, production-ready systems. Approximately 70% of the role will focus on pre-silicon 3D electromagnetic modeling and channel data extraction, with the remaining time dedicated to signal integrity analysis, design iteration, and cross-functional collaboration.
Required Skills
- 5–10+ years of dedicated experience in signal integrity and packaging analysis.
- Expert proficiency with industry-standard simulation tools, including:
- Ansys HFSS
- Ansys SIwave
- Keysight ADS
- Proven experience analyzing high-speed interfaces such as:
- PCIe
- UCIe
- SerDes
- Experience conducting full-system signal integrity analysis across components, substrates, chip packages, and PCB designs.
- Ability to build and extract 3D electromagnetic models for packages, boards, substrates, and interconnect paths.
- Strong knowledge of:
- Eye diagrams
- Jitter
- Insertion loss
- Return loss
- Crosstalk
- S-parameter analysis
- Solid understanding of PCB stack-up architecture, material properties, routing rules, and high-speed design fundamentals.
- Ability to interpret simulation results, identify signal performance issues, and recommend design improvements.
- Strong collaboration skills and the ability to work effectively with multidisciplinary hardware engineering teams.
Nice to Have Skills
- Experience automating simulation workflows and post-processing using Python, JavaScript, or Ocean/SKILL scripting.
- Hands-on experience with laboratory characterization equipment, including:
- Vector network analyzers
- Time-domain reflectometers
- High-speed oscilloscopes
- Experience with model-to-measurement correlation.
- Exposure to post-silicon lab bring-up and measurement validation.
- Experience with DDR memory channels and related high-speed design analysis.
Preferred Education and Experience
- Bachelor’s or master’s degree in Electrical Engineering, Electronics, or a related field.
- 5–10+ years of relevant industry experience in signal integrity, packaging analysis, high-speed design, or a related discipline.
Other Requirements
- Available as a remote or hybrid opportunity.
- Hybrid work locations are available in Boston, MA, or San Jose, CA.
- Employment may be available on a contract or full-time basis.
- Ability to support pre-silicon 3D electromagnetic modeling, channel data extraction, signal integrity analysis, and design iteration.
- Post-silicon lab bring-up, measurement validation, and correlation may be required as needed.
